Muhlbauer GmbH & Co. KG

MuhlbauerModel CME 3060 -Chip Module Encapsulation System

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At the encapsulation process of IC Module Production, the resin is dispensed to protect chip and wires against mechanical and environmental stress. Typically, the black thermal curing material or the transparent UV curing material are used for the encapsulation. Due to the high accuracy of this method, no additional surface treatment like milling is necessary. For the dispensing process itself, two different methodes can be used: Dam&Fill or Glob Top. In the Dam&Fill mode, the first dispensing head places a dam bar to limit the glob top area. Then, a second dispensing head fills the area inside the dam. In the Glob Top mode, both dispensing heads completely fill the whole module.

Most popular related searches
  • Integrated thermal and/or UV (LED) curing station
  • New dosing design program for easy recipe creation
  • Inline integration of Tape Inspection System TI 2280 (optional)
  • 50% more curing capacity compared to other systems
  • Up to 38,000 UPH

KEY FEATURES

  • Integrated thermal and/or UV (LED) curing station
  • New dosing design program for easy recipe creation
  • Inline integration of Tape Inspection System TI 2280 (optional)
  • 50% more curing capacity compared to other systems

NEW FEATURES FOR CME 3060

  • 16-fold shaft dosing head V66
  • 16-fold membrane dosing head V60
  • Purging stations for dosing heads in stop or standby mode by vision cameras
  • Inline automatic process control to monitor the encapsulation of all nozzles
  • CNC programming software for easy & fast dosing layout creation
  • Visualization cameras for accurate dosing head adjustment

DESIGN

  • Automatic spooling systems for 35 mm reel-toreel module tapes & spacer tapes incl. reverse mode
  • Automatic tape indexing system
  • Vacuum fixing of the tape at dispensing positions
  • Tandem dosing head for Dam&Fill or Dual Glob Top (without buffer)
  • IC module output counter
  • Locked production cabinet
  • ETS menu-driven operator interface
  • Spooling systems TS 1150/I, /O

THROUGHPUT

  • Up to 38,000 (Dual Glob Top)
  • Up to 23,000 (Dam&Fill)