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Hitachi High-Tech - Model CMI760 Series -Coating Thickness Handheld Gauges for PCB Copper
The CMl760 accepts multiple probe types to meet almost any PCB application, including surface copper, and through-hole applications. Our CMl760 comes standard with the SRP-4 probe and an advanced statistical package for interpretation of test data. This instrument is highly-expandable, capable of both micro-resistance and eddy current testing for the accurate and precise measurement of copper. Optional accessories are available to measure thru-hole copper thickness.
SRP-4 PROBE
The CMI760" includes a tethered SRP-4 Probe with user-replaceable tips tor added convenience and its more cost effective. This probe consists of (our pins encased securely in a patented design tor durability and resistance to breakage and wear. A see-through casing allows tor easy placement o( the probe on small traces. The tethered cable is ideal tor field applications plus its small footprint is convenient and user-friendly.
OPTIONAL ETP PROBE
Using our ETP Probe the CMI760" operates with eddy current. This probe generates accurate readings regardless of the board`s multiple layers, working equally well on double-sided and multilayer boards, before and after etch, even with tin and tin/lead resist. It also provides a temperature compensation feature, for measurement of the board immediately after it is lifted from the plating tank.
KEY FEATURES:
- Dual technology - eddy current and microresstance.
- Surface and thru-hole probes.
- Active statistical display.
- Optional loot switch.
GAUGE SPECIFICATIONS
- Dimensions: in : 11 1/2" (W) x 10 1/2" (D) x 5 1/2" (H). cm: 29.21 (W) x 26.67 (D) x 13.97 (H).
- Weight: 6 lbs. (2.7 kg).
- Unit: Select from mils, urn, uin, mm, ia, or % as units tor display.
- Display: Large LCD 480 (H> x 32 (V) pixels, backlit, wide-angle view.
- Statistical Display: Readings, standard deviation, mean, high/low.
- Charts: Histogram, trend. x-Bar. and r-chart.
SRP-4 PROBE:
- Accuracy: ±1% (±0.1 urn) referred to reference standard.
- Precision: Bectroless Copper: 0.2% typical.
- Electrodeposited Copper 0.3% typical.
- Resolution: mil: 0.01 at > 1. 0.001 at < 1. urn: 0.1 at > 10. 0.01 at < 10,0.001 at <1.
ETP PROBE SPECIFICATIONS:
- Accuracy: ±0.01 mil (0.25 urn) < 1 mil (25 pm).
- Precision: 1.0% at 1.2 mil typical.
- Resolution: 0.01 mils (0.25 pm),
- Eddy Current: Conforms to method ASTM E376 Thickness Range: 0.08-4.0 mils (1 -102 um).
- Minimum Hole Size: 35 mils (899 um).