DELO - Bonding Smartphone Cameras or XR-cameras
DELO specializes in advanced adhesive solutions specifically tailored for the consumer electronics industry. Their portfolio includes DELO PHOTOBOND, DELO DUALBOND, and DELO KATIOBOND series, renowned for high resistance to humidity and rapid curing capabilities. These adhesives are crucial in enhancing miniaturization, performance, and reliability of electronic devices such as smartphones, tablets, and wearables. DELO's products are optimized for bonding components like mini speakers, camera modules, and MEMS microphones, as well as sealing sensors. The adhesives also cater to flexible electronics, enabling high conductivity and structural integrity in lightweight, flexible components. Their solutions ensure efficient production processes with high throughput by meeting rigorous industry standards like drop tests and accelerated aging. This makes DELO adhesives suitable for highly automated manufacturing environments, providing robust mechanical and electrical properties for a wide range of electronic applications.
Smartphones generally have several cameras. Modern camera modules are ultra-compact and contain many tiny components. Various adhesives are required to bond the individual components. DELO has an extensive product portfolio to deliver the optimum solution for each of the more than 30 bonding tasks.
For lens bonding and active alignment processes, for example, DELO has developed special dual-curing products and mCD- &VLT-based adhesives. They can be fixed under light in less than a second, cured at very low temperatures ≥ 60 °C and offer properties such as low outgassing, high temperature stability and humidity resistance. And when it comes to the simultaneous structural bonding and electrical contacting (grounding) of metal components, special isotropic, electrically conductive adhesives from the DELO DUALBOND and DELO MONOPOX series are suitable for this task. They are optimized for low-temperature curing and dispense with soldering processes that can damage temperature-sensitive components.
Typical bonding areas on camera modules
- Housing bonding with active alignment
- Alignment and bonding of several camera modules to one another
- Actuator bonding
- Anchoring
- Grounding
- Filter bonding
New applications / trends
- Moving Iris
- Periscope Camera
Properties of DELO smartphone camera adhesives
- Low outgassing, low shrinkage
- Fixation in < 1 s
- Curing at low temperatures ≥ 60 °C
- Adjusted flow behavior
- Good adhesion to substrates such as FR4, LCP and ceramic
- High drop test resistance
- Solvent-free
- Halogen-free according to IEC 612409-2-21
- PFAS-free