Amphenol Communications Solutions (ACS)
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- DensiStak - Board-to-Board Connector
DensiStak - Board-to-Board Connector
High density / high speed / dual-beam contact / Uscar-2 compliant board-to-board connector. Amphenol FCI Basics DensiStak™ connector is designed with its 11 rows 1000+ high density pin count, high speed up to PCIe® Gen 4 with 16Gb/s. Reliable dual-beam contact system, compact size with pitch 0.80mm x 1.25mm, USCAR-2 compliant, and optional shields.
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RoHS
- High Density upto 1034 pos
- High Speed, upto PCIe® Gen 4 with 16Gb/s
- Dual-Beam Contact system
- Compact size
- USCAR-2 compliant
- High Density 11-Row 1000+ positions
- High speed performance up to 16Gb/s
- Dual-beam contact system
- Compact design with 0.80mm in X direction and 1.25mm in Y direction
- USCAR-2 compliant
- Open-Pin-Field Design
- Surface mount soldering tails
- RoHS compliant, halogen and lead-free
- UL94V-0 high temperature material
- Provides solution to connect with chips with high speed, low speed and power needs
- Meets PCIe® Gen 4, Ethernet, USB, DP, and MIPI protocols
- Reliable design
- Saves board space
- Supports automotive application
- Design flexibility
- Makes customer soldering easy
- Meets health, safety and environment requirements
- With-stand harsh environment
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