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E-Grind - Resin Bond Mesh Diamond Powder
Each Particle is with sub-crystal structure. Irregular and Very rough surface. New cutting edges come out during working. Also available in electroless plating of both nickel (30% and 56% by wt.) and copper (50% by wt.) allowing for better crystal retention in both phenolic and polyimide bond systems.
Application:
For Resin Bond system
Application: grinding tungsten carbide, ceramics, glass, and other non-metal materials.
Resin Bond Mesh Diamond: EA-R15
Rough and very irregular, Highest Friable, Yellow Green Color
Best self-sharpening performance and high thermal stability, suitable for creep grinding, the good choice for high precision grinding where premium surface finish and form remaining are demanded.
Available sizes:60/80 through 400/500
Resin Bond Mesh Diamond: EA-R23
Irregular, medium-high Friable, Yellow Green Color.
Good combination of high free cutting and high surface finish. The first choice for the products with critical cost.
Available sizes:60/80 through 400/500
Resin Bond Mesh Diamond: EA-R21
Irregular, low Friable, light Green Color
Similar to EA-R23
Available sizes:60/80 through 400/500
Resin Bond Mesh Diamond: ED-B100
Semi-blocky, very low friability, Black
Premium performance in thermal stability
For Vit bond system with good profile retention and sharpness