Advanced Energy Industries, Inc.

Luxtron FluorOpticModel M-1000 -Fiber Optic Temperature Sensors

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FluorOptic Temperature Converter for measurements between -200 to 450 °C (-328 to 842 °F) in semiconductor applications. The Luxtron® M-1000 is Advanced Energy’s newest FluorOptic® Thermometry (FOT) converter platform enabling accurate temperature measurement as low as -200 °C and up to 450 °C for advanced semiconductor applications in etch and deposition.

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Advanced Energy’s Luxtron® FluorOptic Temperature (FOT) Sensors use the principles of phosphorescence to deliver high-accuracy temperature monitoring for critical semiconductor applications such as plasma etch and plasma enhanced deposition. The sensors are immune to interference from RF and microwave sources, enabling the sub-1 °C process control required to achieve device performance and yield for leading edge semiconductor devices.

The Luxtron M-1000 is the latest FOT converter platform, featuring an advanced light source and improved electronics for ultralow noise. In addition, two new proprietary phosphor formulations, VioLux and RubiLux, have been developed to work in concert with the M-1000 to deliver sub-0.5 °C accuracy, repeatability, and stability over an extended range -200 to 450 °C (-328 to 842 °F). This extended temperature range enables both cryogenic and high temperature etch processes, both of which are critical for etching advanced high aspect ratio devices, such as 3D NAND.

  • Wide supported temperature range
  • Low noise level with fast response rate
  • Non-contact measurement to minimize the thermal offset
  • Easy to install into OEM equipment

  • Custom OEM probe design and quick-turn prototypes from experience engineering team
  • Sensors are immune to interference from RF and microwave sources
  • Option to separate the sensors from the probes for increased accuracy and repeatability

  • Measurement Range: -200 to 450 °C (-328 to 842 °F)
  • Accuracy: ± 0.5 °C, mix and match
  • Noise: ≤ 0.05 °C
  • Interface: ECAT, 4 to 20 mA or 0 to 10 V
  • Converter Ambient Operating Temperature: -10 to 60 °C (14 to 140 °F)
  • System Storage (In Packaging): -20 to 75 °C (-4 to 167 °F)
  • Channels: Up to 5
  • Plasma Etch, Electrostatic chuck temperature
  • Plasma Etch, Dielectric window or chamber lid temperature
  • Microwave Heating
  • PEALD, PECVD Electrostatic chuck