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Film SenseModel FS-RT300 -Automated Mapping System

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These products combine an FS-1EX Multi-Wavelength Ellipsometer with compact automated mapping stages to provide fast, accurate, and reliable thin film thickness uniformity measurements across a wafer.

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  • 6 wavelengths of ellipsometric data (405, 450, 525, 660, 850, 950 nm), with long life LED sources, and no moving parts detector
  • Accurate thin film thickness measurements for most transparent thin films from 0 – 5 μm
  • Typical thin film thickness repeatability: 0.002 nm
  • Integrated focusing probes, standard spot size: 0.8 x 1.9 mm (other spot sizes available)
  • USB camera option available
  • Motorized Z-stage for sample auto-alignment
  • Flexible Scan Pattern Editor
  • Contour and 3D plots of measured parameters

  • Typical time for thin film thickness wafer map: 2.5 minutes (49 points on a 300 mm diameter wafer)
  • Compact footprint: 400×500 mm, 22 kg
  • Stage travel: R (linear) 150 mm, resolution: 12 μm Theta (rotation) 360°, resolution: 0.1°