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Heidelberg Instruments - Model MLA 150 -Advanced Maskless Aligner
The fastest Maskless Aligner for R&D, rapid prototyping and small production volumes, designed for binary lithography. The Maskless Aligner MLA 150 is a state-of-the-art maskless lithography tool. Areas of application include nanofabrication of quantum devices (2D materials, semiconductor materials, nanowires, etc.) MEMS, micro-optical elements, sensors, actuators, MOEMS and other devices for materials and life sciences. Depending on the application, the MLA 150 patterns high-resolution, high aspect ratio, and even simple grayscale structures.
Our Maskless Aligner series, first introduced in 2015, is now firmly established as an alternative to the traditional mask aligner, fully eliminating the need for masks. The maskless approach leads to significantly reduced cycle times. Any design modifications can be quickly implemented by simply changing the CAD layout. The system also features fast automated front- and backside alignment procedures and outstanding speed: Exposing an area of 100 x 100 mm² with structures as small as 1 µ takes less than 10 minutes.
The 150th MLA 150 installed in 2022: The MLA 150 Success Story
Perfect for Multi-user Facilities
Less than 1 h training to fully qualify as a user
Fast and Accurate Alignment
250 nm front alignment, backside alignment, alignment error compensation
Flexible
Two lasers can be installed simultaneously on the same system to expose the whole range of photoresist
Low Operation Costs and Easy Maintenance
10-20 years of laser lifetime
Direct-write Lithography
No mask-related costs, effort, or security risks
Grayscale Mode
For simple 2.5D structures
Exposure Quality
Edge roughness 60 nm; CD uniformity 100 nm; 40 nm address grid; autofocus compensation for warped/corrugated substrates
User-friendly
Specifically designed software and workflow make the tool operation fast and easy
Exposure Speed
150 mm wafer in
