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Heidelberg Instruments - Model MLA 300 -Maskless Aligner for Volume Production
Optimized for industrial manufacturing, ensuring high throughput and seamless production line integration. The Maskless Aligner MLA 300 provides high throughput, a simplified workflow, and integration with manufacturing execution systems (MES). This tool is used for the production of sensors and sensor ICs, MEMS, and microfluidic devices. Other applications include discrete electronic components, analog and digital ICs, ASICs, power electronics, OLED displays, and advanced packaging.
The MLA 300 achieves the highest optical quality and precision. The standard exposure module achieves a minimum feature size of 1.5 µm. Writing modes for higher throughput and higher resolution are on our roadmap. The MLA 300 features full automation with customizable loading options, software designed for production environments, and patented substrate tracking technology.
The MLA 300 reduces production costs and effort by overcoming the requirement for mask procurement, verification, and management. Operating costs benefit from a long-lifetime exposure laser (estimated 10 years at 24/7 production) and fewer consumables. Modularity enables fast maintenance, replacement, or repair. Real-time autofocus compensates for substrate warp or corrugations, ensuring flawless patterning. Maskless lithography allows per-die pattern corrections and serialization for full tracing of product characteristics, such as sensor calibration.
Direct-write Lithography
No mask-related costs, effort, or security risks
Flexibility
Direct writing in industrial production allows per-die pattern corrections, e.g. to react to distortions or process variations and serialization
Time-saving
Shorter time from prototyping to production. Digital design management replaces conventional mask library
Exposure Quality
Optical compensation of scaling, rotation; patented substrate tracking technology
Dynamic Autofocus
Superior critical dimensions (CD) uniformity on warped or corrugated substrates
Exposure Speed
300 x 300 mm2 in 19 minutes
Full Facility Integration
Customizable automatic loader, substrate chuck including warped substrates, custom workflow “wizards” and interface with manufacturing execution systems (MES)
User-friendly
SEMI-compliant user interface; customized workflow “wizards” for system operators
Automated Loading Module
SEMI-standard BOLTS plane can be configured for open cassettes or Load Ports for FOUP. The number and configuration of ports can be selected and customized for round or rectangular substrates
Manufacturing Execution System (MES)
Integration Customizable workflow “wizards” to start exposure jobs, and integration to a central MES via SECS/GEM or OPC-UA protocols
Backside Alignment
Visual or through-wafer IR backside alignment available with 1 µm positioning accuracy
Exposure Wavelengths
High-power diode lasers with 7 W at 375 nm or 20 W at 405 nm with long lifetime are available
Multipurpose Vacuum Chuck
Customized vacuum chucks are available for applications with special substrates (e.g. warped panels)
Service Contracts
Service contract grades for faster on-site support and participation in the spare parts pool
