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HS-Group GmbH
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HS-Group - Model HP-MET Series -High Vacuum Web-Coater for Packaging

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The HS-Group's HP-MET vacuum coil coating system offers advanced roll-to-roll metallization solutions specifically designed for packaging materials requiring superior barrier properties. Engineered for high productivity, this system effectively addresses the demands of industries with narrow margins by combining low-cost operations with optimal product characteristics. It utilizes vacuum deposition techniques, including aluminum and plasma reactive deposition of aluminum oxide, applied on flexible substrates like CPP, BOPP, and PET. Enhanced plasma treatments improve barrier performance, durability, and stability, providing excellent protection against permeation of oxygen and water vapor—key factors for preserving the integrity of sensitive contents in packaging. The technology caters to the growing market for efficient thin-film coatings, driven by increasing global demand from emerging middle classes. The system features up to 3300 mm coating widths, web speeds reaching 1000 m/min, and accommodates materials such as AL, ALOx, and CU.
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The HS-Group HP-MET type vacuum coil coating system is the roll-to-roll metallization solution for packaging materials with very good barrier properties.

Highest productivity in an industry with low margins, combined with excellent product properties, is the answer to tomorrow's challenges. Vacuum deposition machines for the deposition of aluminum and plasma reactive deposition of aluminum oxide on flexible materials such as CPP, BOPP and PET.

Barrier performance, durability and long-term stability of the finished packaging materials have been optimized with a plasma treatment to achieve even better permeation values.

Protection and durability of sensitive contents are becoming increasingly important in modern packaging. A high diffusion barrier to protect the contents from various external influences, e.g. For example, oxygen and water vapor is a crucial criterion in food packaging and other industries.

The demand for thin-film packaging in combination with good barrier properties has always been predicted in the past and has always been confirmed in recent years.

In all probability, this trend will also lead to a correspondingly large growth potential, in particular due to the emerging middle class in populous countries.