HyPhoX GmbH

HyPhoXWafer-Level Photonic Biosensors for Efficient Sensing

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HyPhoX is revolutionizing the production of photonic biosensors with its patented wafer-level manufacturing process. This method allows the mass production of complete sensing systems on standard silicon wafers, departing from the traditional labor-intensive assembly. The biosensors are exceptionally compact, with chip sizes reduced to just one square millimeter. This not only facilitates the production of millions of units but also significantly cuts down the carbon footprint per chip. Their photonic biosensors are characterized by high sensitivity and specificity, crucial for accurately detecting trace components. The label-free detection feature allows direct analysis without additional labeling steps, enhancing efficiency and preserving sample integrity. Furthermore, these biosensors can perform multiplex analyses, testing multiple targets simultaneously, which is ideal for applications in medical diagnostics, environmental monitoring, and beyond. The fully automated packaging integrates microfluidics, photonics, and microelectronics, enabling portable and rapid point-of-care diagnostics.

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WAFER LEVEL PRODUCTION PROCESS

HyPhoX stands out with a patented wafer level production process.
Conventionally, photonic biosensors have been produced through laborious individual component assembly.  Our new process mass produces complete sensing systems directly on an industry standard silicon wafer.

SIZE-REDUCTION and CO2 MINIMIZATION

Our revolutionary technique shrinks the chip size down to a record low size of just one square millimeter. This not only allows to produce millions of chips but also introduces environmental benefits by drastically reducing the carbon dioxide (CO2) footprint per chip.

FULLY AUTOMATED CHIP PACKAGING

A key enabling technology is the fully automated bonding packaging process which brings together three worlds: microfluidics, photonics and microelectronics.