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Heidelberg Instruments - Model DWL 2000 GS / DWL 4000 GS -Industrial-Level Grayscale Lithography Tool
The DWL 2000 GS / DWL 4000 GS laser lithography systems are fast and flexible high-resolution pattern generators. They are optimized for industrial-level grayscale lithography and designed for high-throughput patterning of masks and wafers for integrated circuits, MEMS, micro-optic and microfluidic devices, sensors, holograms, and security features on banknotes and ID cards. The Professional Grayscale Lithography Mode enables patterning of complex 2.5D structures in thick photoresist over large areas. With a minimum feature size of 500 nm, a write area of up to 400 x 400 mm2 and optional automatic loading system, the DWL 2000 GS / DWL 4000 GS systems are particularly suitable for wafer-level micro-optics used for telecommunications, illumination, and industrial display manufacturing, as well as for device fabrication in life sciences.
Exposure Quality
CD uniformity 60 nm; edge roughness 40 nm; alignment accuracy 60 nm; 2nd layer alignment 250 nm; autofocus compensation 80 µm
Grayscale Lithography
1000 gray levels; dedicated GenISys BEAMER software for optimizing the exposure of complex geometries
Temperature-controlled Flow Box
Temperature stability ± 0.1°, ISO 4 environment
Exposure Speed
area of 200 x 200 mm2 in grayscale mode in <60 minutes
Large Substrate Size
Up to 20 / 40 cm
5 Write Modes
Minimum feature sizes from 500 nm to 2 μm
Exposure Wavelength
Diode laser at 405 nm
Autofocus
Air-gauge or optical
Automation
Loading unit; additional substrate carrier station, pre-aligner, and substrate scanner
GenISys BEAMER
Conversion software packages with 3D proximity correction (3D-PEC) for grayscale exposures of complex shapes
System features:
Light source: Diode laser with 405 nm
Maximum substrate size: DWL 2000 GS: 9″ x 9″ / DWL 4000 GS: 17″ x 17″
Substrate thickness: 0 to 12 mm
Maximum exposure area: DWL 2000 GS: 200 x 200 mm² / DWL 4000 GS: 400 x 400 mm²
Temperature controlled flow box: Temperature stability ± 0.1°, ISO 4 environment
Real-time autofocus: Optical autofocus or air-gauge autofocus
Autofocus compensation range: 80 μm
System dimensions:
Lithography unit (width × depth × height); weight: 2350 mm × 1650 mm × 2100 mm; 3000 kg
Electronic rack (width × depth × height); weight: 800 mm × 600 mm × 1800 mm; 180 kg
Installation requirements:
Electrical: 400 VAC ± 5 %, 50/60 Hz, 16 A
Compressed air: 6 - 10 bar
Cleanroom: ISO 6 or better recommended