InWaClean

• The wafer is kept wet throughout the entire process until drying, in order to prevent the electrostatic bonding of particles
• Ultrasonic cleaning employing various frequencies
• No etching of wafer surface, thus best initial conditions for a variety of texture processes
• Special roller construction reduces operating costs
• Rinsing cascade reduces water consumption
• RENA AirChannelDryer technology

Process

•  Final cleaning and drying of pre-cleaned rectangular silicon wafers
•  Ultrasonic cleaning at different frequencies
•  Optimised inline transport system for thin solar wafers
•  Rinsers connected as cascades to minimise water usage
•  Cleaning is supported by minimum quantity of cleaning chemicals

Dimensions

         Multi-lane transport system:10570 x 2000 x 2200 mm
                                                      (length x width x height)
         Medium-size:5950 x 2000 x 2200 mm
                             (length x width x height)

Throughput

       
Multi-lane transport system    Multi                             Mono
Wafer size 156 mm                 up to 4000 wafers/h    up to 3500 wafers/h
Medium size       
Wafer size 156 mm                 up to 4000 wafers/h    –