Komax MicroLab - Model 11 -Portable All-In-One Micrograph Laboratory Device
The MicroLab 11 is a portable all-in-one micrograph laboratory solution with integrated automatic cutting and semi-automatic grinding functions. The MicroLab 11, despite its compact size, delivers flexibility and mobility. It comes equipped with a high-resolution camera and the Smart Vision v.3 evaluation module, offering impressive micrograph analysis capabilities with minimal investment. Furthermore, the system is adept at handling small wires and accommodating modest production capacities. It achieves precise wire positioning and alignment through a multi-directional panning and micro-adjustment X-Y table, ensuring accuracy in operations.
Mobile hardcase with a rugged exterior for easy transportation
The Microlab 11 is delivered as a compact all-in-one unit. To ensure secure mobility, it features a robust hardcase that can withstand potential shocks during transportation.
Suitable for miniature wires and small production capacities
The Microlab 11 processes small cross-sections ranging from 0.05 mm² to 15 mm², designed to ensure high quality for small-volume production.
MicroLab 11
Metric
- Dimensions/height: 340 mm
- Dimensions/length: 490 mm
- Dimensions/width: 340 mm
- Weight: 35 kg
- Magnification min.: 0.75 fach
- Magnification max.: 5.0 fach
- Range of application of the cutting/cutting module min.: 0.05 mm²
- Range of application of the cutting/cutting module max.: 15 mm²
- Speed of the cutting disk/cutting module: 2800 r/min
- Feed rate/cutting module: ~2 mm/s
- Speed of the polishing wheel/polishing module: 2800 r/min
- Height adjustment range/polishing/polishing module min.: 0.00 mm
- Height adjustment range/polishing/polishing module max.: 5.00 mm
- Processing time/etching module min.: 2 sec
- Processing time/etching module max.: 30 sec
- Field of View: 1.2 mm - 8.2 mm (X-direction)
- Feed Rate Polishing Module: ~6 mm/s
- Adhesive sandpaper outer diameter: 100 mm
- Cutting wheel inner diameter: 16 mm
- Cutting wheel outer diameter: 100 mm
- Cutting wheel thickness: 0.5 mm
Imperial
- Dimensions/height: 13.4 in
- Dimensions/length: 19.3 in
- Dimensions/width: 13.4 in
- Weight: 77.2 lb
- Magnification min.: 0.75 fach
- Magnification max.: 5.0 fach
- Range of application of the cutting/cutting module min.: AWG30
- Range of application of the cutting/cutting module max.: AWG6
- Speed of the cutting disk/cutting module: 2800 r/min
- Feed rate/cutting module: ~0.1 in/s
- Speed of the polishing wheel/polishing module: 2800 r/min
- Height adjustment range/polishing/polishing module min.: 0.00 in
- Height adjustment range/polishing/polishing module max.: 0.2 in
- Processing time/etching module min.: 2 sec
- Processing time/etching module max.: 30 sec
- Field of View: 1.2 mm - 8.2 mm (X-direction)
- Feed Rate Polishing Module: ~0.24 in/s
- Adhesive sandpaper outer diameter: 3.94 in
- Cutting wheel inner diameter: 0.6 in
- Cutting wheel outer diameter: 3.9 in
- Cutting wheel thickness: 0.02 in