Logic-Coating - Beam Splitter Method - Programming System

Logic-Coating can be thought of as a kind of whiteboard onto which electrical diagrams may be drawn. Freed from the constraints of working within conventional two-dimensional designs, designers can now exploit their full three-dimensional capabilities. In its original electronic state the Logic-Coating® polymer is an excellent dielectric and electrical pathways can be created with ease. Circuits are created by selectively exposing the material to a low powered laser (0.6Watts). The exposed areas are converted from a dielectric into a hyper-conductive 3D pathway. Sub-surface and surface-paths are fully insulated from each other and Z axis connections can be used to connect the various layers.

Designers are free to use standard, commercially available 3D CAD programs to create both the circuit designs and laser program paths. Multi-layer paths can be created in 3D resulting in higher circuit densities per given area. Smaller more efficient 3D circuits can be produced in a shorter period of time, and have unique properties never before available. Changes can be implemented quickly by simply changing the 3D Cad design. Benefits include reduced time to market and more design freedom. Alternate designs can be created quickly and evaluated. Other properties allow an unprecedented ability to add features and design unique new products.

The first mode of operation could be defined as Industrial and enables selective laser marking of a precise point within the coating using a Beam Splitter. The laser beam is split into two low-power beams which are guided along two separate optical pathways and projected into the surface at a predetermined angle.

The split beams are not powerful enough to mark the coating and pass through the polymer in total isolation. When they meet at the desired point the combined beams are again powerful enough to trace a conductive path within the polymer. The movement of these beams over three axes facilitates the creation of 3D pathways.