MacuSpec - Model VF-TH Series -Copper Via Fill

The VF-TH Series are copper plating baths that can simultaneously fill copper micro vias and plate through holes with aspect ratios of up to 5:1 on a wide range of structure sizes with great physical properties. MacuSpec VF-TH technology reduces the number of processing steps without a reduction in reliability. The MacuSpec VF-TH 300 process also eliminates post plating annealing by plating a deposit that is resistant to V-pitting during etching. The copper deposited from the VF-TH Series baths has superior physical properties, passing IPC 6012D, DS, and 6013D standards. These standards require tensile strength to be no less than 40,000 PSI and elongation to be no less than 18%.