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mAgic - Microbond Assembly Materials
Microbond Assembly Materials has established the mAgic product brand in 2010 for lead-free sintering pastes and sintering adhesives. Based on the highest thermal requirements of our Direct Copper Bonding (DCB) customers, the earliest sinter products developed in 2009 already provided superior thermal and electrical performance. These products have been in use for more than 2 years in the industry and demonstrate their performance in high power circuits every day.
As a leading materials supplier for the die attach industry we are developing new lead-free solutions for lead frame applications utilising our experience in the field of DCB applications. The replacement of high lead solders is one of the biggest challenges today. The mAgic sinter materials provide the potential to replace lead-containing solders in current discrete power devices. Devices built with mAgic paste will have superior thermal and electrical performance and comply with future legislations.
The sinter concept can also be used to improve the performance of existing die attach adhesives, leading to higher electrical and thermal conductivity. This new product series called mAgic sinter adhesive combines the strength of die attach epoxies and solders. It provides the flexibility and low process temperature of adhesives and at the same time shows a thermal conductivity comparable to solders.
The mAgic product technology platform, consisting of sinter pastes and adhesives, will cover existing and future requirements for medium and high power packages.