Model EDX8000T Plus -Plating Thickness Analyzer

Only in this way can we ensure that the products produced are not only reliable in quality, but also loved and welcomed by users. At the same time, this can also help companies avoid unnecessary quality problems and losses. Coating thickness analysis can also improve the user experience and service life of the product. For products involving metal or electronic components, the thickness of the coating will directly affect the service life and safety performance of the product. If the thickness of the coating is not up to standard, the product will easily fall off and oxidize after long-term use, which will have a negative impact on the user experience. Therefore, manufacturing companies must conduct accurate coating thickness analysis to ensure that the coating of the product meets the requirements, which can effectively improve the reliability and service life of the product and improve user satisfaction. Coating thickness analysis can also help companies save costs and improve production efficiency. Traditional plating technology often requires a lot of manpower and material resources for debugging and improvement, and it is difficult to achieve precise control of the process. However, with the continuous development of modern science and technology, automated production technology based on coating thickness analysis can already be realized. Compared with traditional production methods, this production method can greatly reduce the consumption of manpower and material resources, while improving production efficiency and product quality.

The coating thickness gauge EDX8000T Plus irradiates X-rays on the sample and measures the thickness of metal films such as coatings through the intensity of the second X-ray reflected from the sample, because there is no X-ray that contacts the sample and is irradiated on the sample. The energy of the ray is very low, so it will not cause damage to the sample. At the same time, the measurement can also be completed within 10 seconds - 30 seconds.

• Micro-spot vertical optical path, specially designed for coating thickness analysis, can analyze irregular sample thickness
• High count rate Silicon Drift Detector (SDD) for fast, non-destructive, high precision measurements
• High-resolution sample observation system, movable high-precision sample platform, accurate and fast positioning of test points
• The whole series is equipped with thin-film FP non-standard sample analysis software as standard, which can measure the thickness and material composition of multi-layer coatings and single coatings at the same time
• Equipped with high-precision manual X-Y platform, making micro-area measurement more convenient

• EDX8000T Plus coating thickness gauge can be used for PCB coating thickness measurement and metal electroplating coating analysis;
• Measured objects include plating, cladding, lamination, coating, chemically formed film, etc.
• It can measure the thickness of various metal coatings such as ion plating, electroplating, evaporation, etc.
• Chrome plating, e.g. plastics with a decorative chrome finish
• Zinc and other anti-corrosion coatings on steel
• Coatings on circuit boards and flex PCBs
• Contact surface of plug and electrical contact
• Precious metal coatings, such as rhodium on gold substrate analysis
• Analysis of functional coatings in the electronics and semiconductor industries
• Analysis of hard material coatings such as CrN, TiN or TiCN
• Can be extended to add RoHS harmful element analysis function, electroplating solution ion concentration analysis

The ESI EDX-8000T Plus XRF

Specifications

• Coating special analysis software, powerful, easy to learn
• Based on the core FP development of the standard-free analysis algorithm to improve the measurement accuracy
• With automatic distance compensation algorithm
• One-click test, one-click print report, test report template can be customized

• Common coating materials that can be analyzed by the film thickness meter EDX8000T Plus
• Can test the thickness and composition content of repeated coatings, non-metallic, light metal, multi-layer multi-element and organic layers
• Single coating application: such as Ag/Cu, Zn/Fe, Cr/Fe, Ni/Fe, etc.
• Multi-coat coating application: such as Ag/Pb/Zn, Ni/Cu/Fe, Au/Ni/Cu, etc.
• Alloy coating application: such as Zn Ni/Fe, Zn Al/Ni/Cu, etc.
• Alloy composition application: such as Ni P/Fe, simultaneous analysis of nickel phosphorus content and coating thickness

• Instrument Size:  520mm*400mm*450mm
• Sample Chamber Size: 430mm*370mm*210mm
• Weight: 35Kg
• Element Range: Mg12-U92
• Content Range: 1ppm- 99.99%
• LOD: 0.005μm, up to five layers
• Detector: High resolution Peltier Cooling SDD Detector(FSDD Optinal)
• DPP Analyzer: 4096 Channels
• X-Ray Tube: 50W Micro focus tube
• Measuring directions: Bottom up
• Collimator: Auto selection of φ0.15mm,φ0.2mm,φ0.3mm,Optional 0.1*0.2mm
• X-ray Generator: 0-50KV
• Power supply: 220ACV 50/60HZ
• High precision sample platform:  
• Manual XY table: 80mm*80mm
• Simple and accurate positioning of the sample by hand
• Working Environment: -10°C to 35°C