Model EDX8000T Plus -Plating Thickness Measurement Equipment

Metal is coated with a variety of substances, including chromium, nickel, and zinc.The most common coating process is traditional electroplating. Other processes include electroless plating, galvanized coatings (commonly applied to steel, iron and aluminum), physical and chemical vapor treatments, anodizing, mechanical coatings, pickling, etching and sputtering.Coating materials must be applied in specific thickness specifications to express the desired properties. Over- or under-plated metal will not work as expected. Over-plating also wastes expensive coating materials. If coating thickness inaccuracies are not detected, the entire roll may eventually be scrapped.

• Micro-spot vertical optical path, specially designed for coating thickness analysis, can analyze irregular sample thickness
• High count rate Silicon Drift Detector (SDD) for fast, non-destructive, high precision measurements
• High-resolution sample observation system, movable high-precision sample platform, accurate and fast positioning of test points
• The whole series is equipped with thin-film FP non-standard sample analysis software as standard, which can measure the thickness and material composition of multi-layer coatings and single coatings at the same time
• Equipped with high-precision manual X-Y platform, making micro-area measurement more convenient

• EDX8000T Plus coating thickness gauge can be used for PCB coating thickness measurement and metal electroplating coating analysis;
• Measured objects include plating, cladding, lamination, coating, chemically formed film, etc.
• It can measure the thickness of various metal coatings such as ion plating, electroplating, evaporation, etc.
• Chrome plating, e.g. plastics with a decorative chrome finish
• Zinc and other anti-corrosion coatings on steel
• Coatings on circuit boards and flex PCBs
• Contact surface of plug and electrical contact
• Precious metal coatings, such as rhodium on gold substrate analysis
• Analysis of functional coatings in the electronics and semiconductor industries
• Analysis of hard material coatings such as CrN, TiN or TiCN
• Can be extended to add RoHS harmful element analysis function, electroplating solution ion concentration analysis

The ESI EDX-8000T Plus XRF

Specifications

• Coating special analysis software, powerful, easy to learn
• Based on the core FP development of the standard-free analysis algorithm to improve the measurement accuracy
• With automatic distance compensation algorithm
• One-click test, one-click print report, test report template can be customized

• Common coating materials that can be analyzed by the film thickness meter EDX8000T Plus
• Can test the thickness and composition content of repeated coatings, non-metallic, light metal, multi-layer multi-element and organic layers
• Single coating application: such as Ag/Cu, Zn/Fe, Cr/Fe, Ni/Fe, etc.
• Multi-coat coating application: such as Ag/Pb/Zn, Ni/Cu/Fe, Au/Ni/Cu, etc.
• Alloy coating application: such as Zn Ni/Fe, Zn Al/Ni/Cu, etc.
• Alloy composition application: such as Ni P/Fe, simultaneous analysis of nickel phosphorus content and coating thickness

• Instrument Size: 520mm*400mm*450mm
• Sample Chamber Size: 430mm*370mm*210mm
• Weight: 35Kg
• Element Range: Mg12-U92
• Content Range: 1ppm- 99.99%
• LOD: 0.005μm, up to five layers
• Detector: High resolution Peltier Cooling SDD Detector(FSDD Optinal)
• DPP Analyzer: 4096 Channels
• X-Ray Tube: 50W Micro focus tube
• Measuring directions: Bottom up
• Collimator: Auto selection of φ0.15mm,φ0.2mm,φ0.3mm,Optional 0.1*0.2mm
• X-ray Generator: 0-50KV
• Power supply: 220ACV 50/60HZ

High precision sample platform

• Manual XY table: 80mm*80mm
• Simple and accurate positioning of the sample by hand
• Working Environment: -10°C to 35°C