Model MPS150 -150 mm Systems

Coax – DC parametric test down to pA levels

• Movable platen with 40 mm height adjustment, 200 μm contact / separation stroke and ± 1 μm repeatability
• Chuck stage with adjustable friction & stage lock, unique Z chuck adjustment and 90 mm pull-out
• Magnetic positioners with 1 μm feature resolution and 3 linear axes with precision ball bearing

Triax – Low-noise measurements down to fA levels

• Stereo microscope: 15x–100x magnification with large field-of-view and camera-ready c-mount
• Four triax probe arms and high-quality triax cables
• Light/EMI shielding (optional)
• Upgrade option for fF-level measurements
• TRIAX chuck with ±8 fine theta chuck rotation, three auxiliary areas, chuck surface with ±5 μm planarity for consistent contact force and overtravel
• East/West to North/South measurements with single setup

RF test up to 67 GHz

• Three probe technologies available: Infinity Probe, ACP Probe, |Z| Probe
• Matching cables and substrates included
• RF chuck ±3 μm surface planarity
• Unique 200 μm platen contact/ separation stroke with ≤± 1 μm accuracy for repeatable contact
• WinCal XE Calibration Software

mmW - 70 GHz through sub-THz and load-pull

• SlimVue microscope with quick lens exchange, 1 μm opitcal resolution, resolving ‹50 μm pads
• Engraved guides on mmW platen for application-specific SIGMA Kits
• Supports broadband, load pull, coax RF and banded waveguide configuration
• Optical feedback on platen position (gauge)
• Vibration Isolation Platform

mmW probing up to THz and load-pull

• SlimVue microscope with quick lens exchange, 1 μm opitcal resolution, resolving ‹50 μm pads
• Engraved guides on mmW platen for application-specific SIGMA Kits
• Supports broadband, load pull, coax RF and banded waveguide configuration
• Optical feedback on platen position (gauge)
• Rock-solid mechanical design and vibration isolation platform
• Submicron stage accuracy
• Motorized positioners
• <+-1 μm separation repeatability
• Micrometer-accuracy and repeatable probe placement and over travel

Failure analysis and design debug

• Stable microscope bridge design and XY microscope with up to 4000x magnification (option)
• Laser cutter and camera ready
• Contact submicron features
• Simultaneous use of probe card and single needles (option)
• Chuck ready for single DUT
• Quickest transition from wafer-to-chip-to-package
• Vacuum positioners with 1 μm feature resolution
• DPP450 positioner with nanometer resolution and accuracy (option)

On-wafer power device characterization

• Multi-purpose SIGMA instrument integration kit
• Triax probe with protected guard
• Seamless integration of various analyzers
• Triax chuck with surface coating for low-leakage measurements up to 3 kV, high-isolation ready
• High-current measurements up to 100 A with lowest contact resistance
• Optional upgrade for 10 kV (coax) operating voltage
• Thin wafer handling capability
• Arcing protection and advanced grounding concept
• Shield Enclosure with interlock for EMI/light-tight environment
• Maximum protection from high-voltage shock for users and devices

Flexibility

• Ideal for a wide range of applications such as RF, mm-Wave and sub-THz characterization, FA, DWC, MEMS, optoelectronic tests and WL
• Re-configurable and upgradable as requirements grow
• Minimizes setup times with no loss in performance or accuracy
• Seamless integration of various measurement instruments

Stability

• Solid station frame
• Built-in vibration-isolation solution for superior vibration attenuation
• Rigid microscope bridge
• Compact and rigid mechanical design
• Highly accurate measurement results
• Incorporates best-known methods

Ease of Use

• Ergonomic and straightforward design for comfortable and easy operation
• Low-profile design
• Simple microscope operation
• Quick and ergonomic change of DUT through pull-out stage
• Minimize training efforts
• Fast time to data
• Convenient operation