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MS sonxSYS SEALUltrasonic Systems for Packaging

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The requirements for sealing films, especially in the food industry, are high. With the MS sonxSYS SEAL pouch ultrasonic module, MS Ultrasonic guarantees you a precise seam design, which can be either firm or peelable, for top seams on three- and four-side sealed pouches as well as stand-up pouches for applications with films but also paper composites and nonwovens. The electro-pneumatically driven module is completed by the powerfull sonic generator MS sonxGEN, a resonant unit as well as an anvil. The top seam sealing module can be integrated into different variants of packaging lines – e.g. HFS (horizontal fill-seal system).

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  • Compact, easy-to-integrate module, versatile adjustment and
    alignment options, can be washed-down
  • Modular delivery capability from the components to the
    complete system
  • Pure recycling of the welded workpieces (in the case of singlematerial
    packaging), as joining is done without adhesives and
    solvents
  • Environmentally friendly technology, as it is more energy-efficient
    and faster compared to thermal processes, Industry 4.0 standards
    in communication
  • Reproducible welding quality with distance sensor for gap
    control and contact switch-off
  • No heat influence on the product to be packaged due to cold
    welding tools, significantly reduced film shrinkage
  • Also ideally suited for new multilayer monolaminates
  • Tight sealing also possible in case of a contaminated sealing area
  • Flexible seam design and minimal seam protrusions
  • Operating frequencies : 20 kHz, 30 kHz, 35 kHz
  • Power : 1,000 W, 2,000 W, 4,000 W peak power
  • Welding force : 250 – 1,100 N
  • Stroke length : 50 mm, 100 mm
  • Drive : electropneumatic, servo-electric
  • Parameterization : Amplitude, force
  • Process control : Power
  • Module weight : approx. 30 kg
  • Dimensions (WxHxL) : 100 x 252 x 673 mm
  • Installation situation : horizontal
  • Sonotrode material : Titanium (coated)
  • Anvil : exchangeable; titanium (coated), steel (hardened)
  • MS sonxANA Software : Fast on-site analysis and parameterization on a Windows-enabled tablet or notebook computer
  • Interfaces : ProfiNet I/O, EtherNet I/P, EtherCAT