OSCPS - Silicon Photonics

Until a few years ago, photonics technology meant replacing wires with fiber one for one, requiring additional expensive and bulky converters. But now integrating micro-photonics and electronic components at the chip level enables a single fiber (that is coupled to the chip) to transport all the information.

According to marketsandmarkets.com "When compared with conventional electronics, silicon photonics provides 90% of its efficiency with one-third the power consumption at one-tenth of the cost."

Optical MEMS or MOEMS (Micro-Opto-Electro-Mechanical Systems) technology potentially eliminates the transformative restrictions of electronics technology, leading to much faster data transmission speeds and greater bandwidth.

OSCP`s PIC based IMUs use optical waveguides to integrate accelerometer MOEMS components with the micro-photonic elements of our gyroscopes.

Wherever possible, OSCP seeks to fully integrate all optical components into the PIC chip, for reduced size, weight, and power consumption, as well as elimination of assembly costs. This will enhance system reliability and reduce optical loss, thereby increasing device sensitivity.