SAM - Model OFHC -Copper Backing Plates

Machined from oxygen-free, high-conductivity copper. For regular, circular disc-type sputtering sources.  Most sputter sources accept a 0.125″ (1/8″) thick target bonded to a 0.125″ thick backing plate. For targets of other thicknesses, choose the backing plate thickness to adjust the total thickness to 0.250″ (1/4″) to suit most applications.