all4 - GP (North America) Inc
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Spray Coating Equipment for Wafer Technology

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The brand new and just hatched all4-PCB spray coater for wafer technology In today’s world, where wafers are getting thinner and thinner, the solution for the challenges the industry is facing are the contactless coating methods from all4-PCB. Some coating technologies touching your cells for applying process solutions bearing the risk for wafer breakage, decreasing yields and increasing cost. Other coating technologies are wasting a lot of valuable process chemicals, e.g. spin coating.

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  • 1- 750 wafer/h (from R&D to production in one tool)
  • Coating thicknesses:
  • 2-20 µm
  • Storable recipes:  20
  • Operation:  user-friendly touch panel
  • Coating principle: contactless
  • Coating control: control your coating with simply two key parameter
  • Software: remote control maintenance with “eyes and ears”