KLA - Model 39xx-3935 and 3920 EP -Super Resolution Broadband Plasma Patterned Wafer Defect Inspection System
The 3935 and 3920 EP broadband plasma defect inspection systems support wafer-level defect discovery, yield learning and inline monitoring for ≤5nm logic and leading-edge memory design nodes. With a light source that produces super resolution deep ultraviolet (SR-DUV) wavelength bands, low noise sensors and advanced algorithms, the 3935 and 3920 EP provide high sensitivity capture of unique defect types.
The 3935 also includes technologies that enable quick resolution of defect issues, including Setup 2.0 infrastructure for scalable enhancements to inspection recipe setup, and DualSENS™ linkage between the 3935 optical inspector and e-beam review systems for enhanced defect sensitivity on low contrast layers. The 3920 EP includes several memory-specific algorithm and binning innovations that support capture and monitoring of critical defects for 3D NAND and DRAM devices. With throughput that supports inline monitoring requirements, the 3935 and 3920 EP pair sensitivity with speed, enabling Discovery at the Speed of Light™, for reduction of the time required to deliver wafer-level data for complete characterization of process issues during development and high volume manufacturing.
Defect discovery, Hotspot discovery, Process debug, EUV print check, Engineering analysis, Line monitoring, Process window discovery
- Tunable super resolution DUV (SR-DUV) broadband illumination source
- Selectable optical apertures
- Low-noise sensor
- Advanced defect detection algorithms, including MCATx, for detection of critical defects
- Multiple technologies that provide actionable data on critical defect types through efficient suppression or separation of nuisance defects, including iDO™ 3.0 with advanced machine learning techniques
- Novel algorithms for capture of critical defects of interest at the edges of memory cells and for binning of defects at critical memory process steps
- Setup 2.0 for scalable enhancements to recipe setup (billable option)
- DualSENS™ linkage between 3935 optical inspectors and e-beam review systems for enhanced sensitivity to low contrast defects (billable option)