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Nanotech Digital - Transfer Valve
Body Material : Aluminum or Stainless Steel; Compact Design; Easy Maintenance using Repair Parts Kit; Applications : Transfer and process chamber isolation in semiconductor systems for less than 450mm wafers.
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| Operation | Pneumatic |
| Flange Size(D) | 32 × 222 / 46 × 236 / 50 × 336 / 56 × 500 |
| Feedthrough | Welded Bellows |
| Gate Seal | Viton O-Ring / Vulcanized Seal |
| Bonnet Seal | Viton O-Ring |
| Response Time | ≤ 2 sec |
| Operate Pressure Range | 1×10-8 mbar to 1200 mbar |
| Differential pressure at opening | ≤ 30 mbar |
| Differential pressure on the gate | ≤ 1200 mbar |
| Leak rate | Stainless : < 1×10-9 mbar l/sec Aluminum : < 1×10-5 mbar l/sec |
| Cycles until first service/td> | ≥1,000,000 |
| Temperature for Valve Body | ≤ 200 °C |
| Temperature for Actuator | ≤ 80 °C |
| Bake Temperature | ≤ 200 °C/td> |
| Materials | Stainless Steel304, AL6061 Anodizing |
| Mounting Position | Any |
| Operating Pressure (N2) | 4 ~ 7 bar |