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Daitron - Model CVP Series -Wafer Contouring Vertical Polisher
This ground-breaking chamfering system can form a trapezoid or radius shape on the edge of an AS-slice wafer using the same resin-bonded wheel. Edge processing of the device wafer prior to BG decreases the amount of wafer breakage or chipping after BG. We also make a Bevel machine designed to form an edge on 2 inch to 8 inch diameter wafers. The Bevel Machine can process materials such as silicon, and many other semiconductive subtrates.
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- Two grinding stations
- Enhanced processing accuracy and shortened processing time by using the Twin-contouring" method, compared to the conventional machine.
- Reduced processing time compared to the conventional machine.
- A built-in wafer profile measurement device is available.
- Enables measurement of the cross-section profile after processing for feedback correction of the processing data.
- Wafer type: Notch
- Wafer Size: 12 in or 8 in (selectable)
- Loading/Unloading: 8-cassette or 2 dry stacks to 6-cassette or 4-cassette (or 2-casstte) (selectable)
- Thickness Measurement Unit: Multi-point measurement
- Fine alignment: Edge contact or non-edge contact
- Qty of grid axis: Two stations
- Spindle: [1] Horizontal circumference grinding (coarse) Metal-bonded wheel (100mm) (Optional), [2] Vertical circumference contouring (finish) Resin bonded wheel (60mm), [3] Vertical circumference contouring 2 (finish) Resin-bonded wheel (60mm) (Optional), [4] Notch grinding (horizontal)
- Metal-bonded wheel (Optional)
- Washing Unit: Included (Edge polishing, 2-fluid washing, high-pressure jet can be included.) (Optional)
- Profile Measurement: Measurement items: cross-section profile, notch profile, diameter, notch vertical surface width