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ACCRETECH - Model W-GM-4200 -Wafer Edge Grinder
The W-GM-4200 Wafer Edge Grinder is designed for the precision grinding of wafer edges up to 200mm, ensuring high levels of accuracy and quality essential for modern semiconductor manufacturing. This machine features a compact design with an innovative grinding unit that achieves precise rotational accuracy and sharp edge profiles, which is crucial for the protection of wafers made from sensitive materials such as GaAs, SiC, or GaN. Utilizing contactless measurement technology, the W-GM-4200 efficiently measures wafer thickness, diameter, and notch depth both before and after grinding. Additionally, advanced mirror-finish technology reduces grinding damage while enhancing surface quality. This makes the W-GM-4200 ideal for achieving impeccable wafer production standards.
The W-GM-4200 stands out with the highest grinding precision and a compact design – perfectly suited to the demands of modern wafer production. Our newly developed grinding unit ensures exceptional rotational accuracy and sharp edge profiles, offering optimal protection for even the most sensitive wafer materials such as GaAs, SiC, or GaN.
With contactless measurement technology, the machine reliably measures wafer thickness, diameter, and notch depth before and after the grinding process, ensuring consistently high quality. The innovative mirror-finish technology minimizes grinding damage and sustainably improves surface quality.
Your Benefits at a Glance:
- Precise grinding for the highest product quality
- Compact design for space-saving integration
- Easy operation for efficient production workflow
- Versatile use for various wafer materials