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Siemens EDA
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  5. Advanced IC Packaging Solutions

Advanced IC Packaging Solutions

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Bringing IC package and IC design together with tools that operate in both the IC and packaging domains, the advanced IC packaging flow offers a complete solution for rapid prototyping/planning of heterogeneously integrated chiplet assemblies, physical design, verification, signoff and modeling.

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IC packaging design and verification
Monolithic scaling limitations drive the growth of 2.5/3D multi-chiplet, heterogeneous integration that enables PPA targets to be met. Our integrated flow addresses IC package prototyping challenges to signoff for FOWLP, 2.5/3D IC and other emerging integration technologies.

Packaging Design

IC Packaging Design tools provide a complete design solution for creating complex, multi-die homogeneous or heterogeneous devices using FOWLP, 2.5/3D or system-in-package (SiP) modules, as well as IC package assembly prototyping, planning, co-design and substrate layout implementation.