PIC Packaging Services

In 2006, PhotonFirst pioneered the development of the world's first Photonic Chip-based Sensing solution. Since then, we have been continuously developing and enhancing our Photonic Integrated Circuit (PIC) packaging capabilities as part of our product production process. As this process matured, PhotonFirst began offering this capability as an external service 10 years ago, assisting customers in developing their PIC-based solutions.