R&D Services

Our experienced team of development engineers can support partners with bridging the gaps in packaging area.

Regardless of the stage of your concept readiness, we can start with simulations and a feasibility study to prove the concept and recommend further steps to achieve the best parameters.

In addition we provide valuable feedback to front-end chip designers to enable their components to be further efficiently integrated into semiconductor packages.

We are here to support you with integration into any subsystems using any of available packaging platforms. We can help to bring your concept to the market.

We understand fully the development cycle of the product EVS – DVS – PVS.

We provide the following outputs based on project readiness level:

• Simulations – thermal, high frequency, optical, electrical, mechanical
• Feasibility study, proof of concept
• Design – mechanical and optical
• Prototype build – evaluation and qualification
• Assembly process development
• Sample batch verification
• Publicly funded projects
• Long-term R&D contracts