Stanford Advanced Materials Corporation (SAM)
SAM - Indium Target Bonding Service
Indium is a soft metal with a low melting point and excellent thermal and electrical properties, which make it the preferred method for bonding sputtering targets. Indium bonding is one of the most efficient target bonding services at drawing heat away from the target. Indium is more malleable than other bonding solders. This reduces cracking that is caused by the mismatch in the thermal expansion coefficients of the target and backing plate.
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- the best thermal conductivity
- the most efficient at drawing heat away from the target
- more malleable than other bonding solders
- reduces cracking that is caused by mismatch in the thermal expansion coefficients of the target and backing plate
- creep and remove stress as dissimilar materials cool
- Maximum Operating Temperature (°C) 150° C
- Thermal Conductivity (W/mK) 83
- Coefficient of Thermal Expansion (K-1) 32.1 x 10-6
- Electrical Resistivity (ohm-cm) 8 x 10-6
- Bond Coverage >95%
- Bond Line Thickness 0.010″ ± 0.003″