ACCRETECH (Europe) GmbH products

The W-GM-4200 Wafer Edge Grinder is designed for the precision grinding of wafer edges up to 200mm, ensuring high levels of accuracy and quality essential for modern semiconductor manufacturing. This machine features a compact design with an innovative grinding unit that achieves precise rotational accuracy and sharp edge profiles, which is crucial for the protection of wafers made from sensitive materials such as GaAs, SiC, or GaN. Utilizing contactless measurement technology, the W-GM-4200 efficiently measures wafer thickness, diameter, and notch depth both before and after grinding. Additionally, advanced mirror-finish technology reduces grinding damage while enhancing surface quality. This makes the W-GM-4200 ideal for achieving impeccable wafer production standards.

The HRG200X is a fully automatic high-rigidity grinder designed for hard semiconductor materials up to 200 mm in diameter. With its ultra-stable construction and dual-axis technology, it minimizes grinding damage and shortens processing times — while maintaining high accuracy and low operating costs. Equipped with an integrated cleaning unit, the HRG200X prevents silicon dust from drying onto the wafer surface. The automatic cleaning function ensures consistently clean processing. The result: a flawless mirror-finish surface, ideal for subsequent manufacturing steps.

The ChaMP 211/232 series developed by ACCRETECH is a high-performance Chemical Mechanical Polishing (CMP) solution tailored for 200 mm wafer manufacturing. These systems are designed to provide precision and reliability, crucial for achieving superior process fidelity and surface finishes. Their modularity and compactness make them adaptable to various configurations, enhancing process control. These systems are engineered for robustness, enabling consistent wafer planarization and defect minimization, which is vital in semiconductor device fabrication. The ChaMP 211/232 also integrates flexibility within its architecture to accommodate different processing needs, ensuring compatibility with diverse manufacturing environments and contributing to higher throughput and reduced cycle times.

The UF190R wafer prober, developed by Accretech, is engineered for handling 100 to 200 mm wafers with a focus on high-speed and modular capabilities, ideal for MEMS, unique formats, and mass production. The UF190R incorporates cutting-edge software and electronics, offering enhanced precision and efficiency meeting contemporary testing demands. Its flexible architecture allows for upgrades, enabling users to adapt the system to various probing applications. Designed for versatility, the UF190R provides robotic handling for precise wafer testing in both standard and specialized scenarios. Within semiconductor manufacturing environments, its role becomes crucial not only for its agility but also for maintaining rigorous quality standards through advanced probing technology.

The PG3000RMII polish grinder from ACCRETECH is a specialized tool for semiconductor manufacturing, combining wafer thinning and defect removal capabilities in a single, integrated system. Tailored for high-volume production, it handles wafers up to 300 mm with precision. The system's design emphasizes efficiency through the integration of multiple processing steps, leading to stable and consistent results. The RM200/300 module specifically enhances the polishing process, ensuring optimal performance. This equipment is particularly suited for applications requiring rigorous quality control and increased throughput, making it indispensable for businesses focusing on efficient semiconductor fabrication.