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ACCRETECH - Model ChaMP 211 / 232 -High-Performance CMP Systems
The ChaMP 211/232 series developed by ACCRETECH is a high-performance Chemical Mechanical Polishing (CMP) solution tailored for 200 mm wafer manufacturing. These systems are designed to provide precision and reliability, crucial for achieving superior process fidelity and surface finishes. Their modularity and compactness make them adaptable to various configurations, enhancing process control. These systems are engineered for robustness, enabling consistent wafer planarization and defect minimization, which is vital in semiconductor device fabrication. The ChaMP 211/232 also integrates flexibility within its architecture to accommodate different processing needs, ensuring compatibility with diverse manufacturing environments and contributing to higher throughput and reduced cycle times.
The ChaMP 211/232 series from Accretech offers precise and reliable CMP machines specifically designed to meet the requirements of 200 mm wafer manufacturing. Modular, compact, and flexible – ideal for process reliability and excellent surface quality.
Your Advantages at a Glance
- Maximum process reliability thanks to the optimal interaction of all components
- Modular and compact design for easy integration into your production line
- Polishing head with Air-Float technology for gentle and uniform polishing
- End Point Detection (EPD) for highly precise, reproducible polishing
- Dry-in/Dry-out process with cleaning option for contamination-free wafer transfer
- Easy maintenance thanks to well-thought-out system design
Who is the ChaMP 211/232 Series Suitable For?
- Semiconductor manufacturers with 200 mm wafer lines
- Production sites focused on process reliability and surface quality
- Development departments and foundries