Angstrom Engineering Inc. products
Angstrom Engineering - Physical Vapor Deposition Platforms Cover
Angstrom Engineering has developed a series of platforms that provide quantum computing hardware pioneers a means to reliably and confidently create superconducting circuits, and their supporting hardware, in a highly repeatable and automated framework.
Angstrom Engineering - High Aspect Ratio Indium Bumps
Angstrom Engineering’s platforms have been designed to provide fine control of both variables to provide complete flexibility of the types of bumps you’d like to create. Paired with our proven automation and high-throughput capabilities, Indium Series™ becomes a workhorse evaporator for bump bond fabrication that is both easy to use and simple to maintain.
Angstrom Engineering - Ion Beam Sputter Deposition (iBSD) Systems
Our Reticle ion beam sputter deposition systems are designed and engineered to create precise optical films of the highest purity, density, and stability. Angstrom Engineering’s Reticle® systems provide a turn-key solution for those looking to realize any optical design into a high-performance film.
Angstrom Engineering - Linear Sputter PVD System
Using the Linear Sputter PVD system from Angstrom Engineering allows you to process thin films of semiconductors or metals on large area panels in display, photovoltaic, and semiconductor applications. We designed these systems to address the challenges researchers face when sputtering over large areas or quantities of substrates. From gas flow and plasma management to magnetron uniformity and temperature control, Angstrom Engineering®’s Linear Sputter PVD systems let you revolutionize your workflow and see higher throughput production than previously possible. Create devices on very large substrates, stacking multiple layers in a single run with great uniformity. Even though the targets are larger than usual, the material is very efficiently utilized.
Angstrom Engineering - Low Pressure Chemical Vapor Deposition System
We engineered a water-cooled furnace that can reach 1100°C in 10 minutes and cool down below 800°C in a mere 2 minutes. Controlled graphene growth is ensured, and the Low-Pressure Chemical Vapor Deposition system keeps processing times to a minimum. Various chamber tube sizes are available between Ø 2 in and Ø 8 in, allowing the processing of single small samples up to batches in 6-inch wafers.