ASM Assembly Systems GmbH & Co. KG products

Our placement solution for high-mix electronics production. With the SIPLACE SX, your factory is ready for anything that comes along. The SIPLACE SX was designed to be flexible. It is the world’s only platform that lets you scale up or down or transfer capacity by adding or removing the unique SX gantries.

Among electronics manufacturers, the SIPLACE X-Series is considered the benchmark wherever maximum speed and absolute precision are required (mobile phones, tablets, notebooks, LED placement, etc). Put its top-of-the-line speed, lowest dpm rates, consistent 0201 (metric) capability, non-stop setup changeovers and fast new product introductions to use for you. The SIPLACE X-Series is available with two, three or four gantries with gantry modularity. Hard to believe? We look forward to hearing from you – and to a comparison with other manufacturers` machines. Find out how you can optimize your specific production processes with the SIPLACE X-Series, how quickly it will pay for itself, and what other competitive advantages it offers.

Chip assembly and SMT placement in a single machine. Integrate high-growth technologies of the future such as flip chips and die attach into your SMT production with the SIPLACE CA, the world’s first platform that lets you flexibly combine the placement of bare dies directly from the wafer with classic feeder-based SMT placement. Your competitive advantage: New, future-proof applications can be implemented on a single SMT line without any additional special processes. It is the ideal machine for “Advanced Packaging” applications. Another benefit: For all other jobs, the SIPLACE CA operates as a powerful “normal” SMT placement machine.