Bodo Möller Chemie GmbH products

GAP PAD® products from Henkel are soft, compliant thermal pads that provide effective thermal interface between heat sinks and electronic components, where uneven surfaces, air gaps and rough surface textures are present. These thermally conductive pads offer high conformability to reduce thermal resistance, even in large gaps. In addition to effective heat dissipation, GAP PAD® materials also help to reduce vibration loads and absorb shock in a variety of applications.

BOND-PLY materials are high performance, thermally conductive pressure sensitive adhesives. They are available in a PSA or laminating format and are used to replace thermosetting adhesives, screw and staple assembly. Repeated high continuous use temperatures increase adhesive strength. BOND-PLY are supplied in sheet, die-cut, roll and tabulated forms. Available in thickness range of 3 to 11 mils. Custom coated thickness.