Bodo Möller Chemie GmbH

BOND-PLYAdhesive Tapes

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BOND-PLY materials are high performance, thermally conductive pressure sensitive adhesives. They are available in a PSA or laminating format and are used to replace thermosetting adhesives, screw and staple assembly. Repeated high continuous use temperatures increase adhesive strength. BOND-PLY are supplied in sheet, die-cut, roll and tabulated forms. Available in thickness range of 3 to 11 mils. Custom coated thickness.

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BOND-PLY adhesive tapes attach a heat sink to a graphics processing unit, power converter PCB or to a drive processor. They attach a heat spreader to a motor control PCB.