Chengyi Electronics (Jiaxing) Co., Ltd products

Application area: Automotive. Product feature: Immersion tin board. Layer: 4. Surface treatment: Immersion Tin. Material: FR4    
Line width/Line space: 0.254/0.20mm. Thickness: 1.6mm. Min hole φ: 0.45mm.

Application area: Industrial control. Product feature: Half hole board. Layer: 6. Surface treatment: ENIG. Material: FR4. Line width/Line space: 0.127/0.133mm. Thickness: 1.6mm. Min hole φ: 0.20mm.

Application area: Motherboard. Product feature: Eight-layer motherboard. Layer: 8. Surface treatment: ENIG. Material: FR4. Line width/Line space: 0.12/0.125mm. Thickness: 1.6mm. Min hole φ: 0.20mm.

Application area: Consumer electronics. Product feature: Resin hole plugging. Layer: 4. Surface treatment: ENIG. Material: FR4
Line width/Line space: 0.22/0.30mm. Thickness: 1.2mm. Min hole φ: 0.20mm.

BGA PCB Board is a surface mount package for integrated circuits. BGAs can provide more interconnect pins than dual in-line or flat packs, each with solder balls. All connections are distributed in a uniform surface grid or matrix on the component.

Damage from additional thermal deviation. Coplanarity issues due to pad-to-pad coating thickness variations. Potential coplanarity issues with HASL finishes. Stencil spacer issues are related to differences in coating thickness and mushroom cap profile (coating) on small pads. The difference in solder coating thickness for lead-free HASL coatings is typically about half the thickness of tin-lead HASL coatings. In this finish, coplanarity is also good. Modern HASL lines are designed to provide operating conditions consistent with other equipment in modern cardboard workshops to avoid heat and smoke problems.