Chengyi Electronics (Jiaxing) Co., Ltd products

Application area: Motherboard. Product feature: Eight-layer motherboard. Layer: 8. Surface treatment: ENIG. Material: FR4. Line width/Line space: 0.12/0.125mm. Thickness: 1.6mm. Min hole φ: 0.20mm.

Application area: Consumer electronics. Product feature: Resin hole plugging. Layer: 4. Surface treatment: ENIG. Material: FR4
Line width/Line space: 0.22/0.30mm. Thickness: 1.2mm. Min hole φ: 0.20mm.

BGA PCB Board is a surface mount package for integrated circuits. BGAs can provide more interconnect pins than dual in-line or flat packs, each with solder balls. All connections are distributed in a uniform surface grid or matrix on the component.