Cicor Management AG products

Flexible printed circuit boards (FPC) are offering the highest level of 3D miniaturization. Very low bending radii in combination with ultra-HDI (ultra-high density interconnect) are enabling our customers to build increasingly smaller and highly integrated devices. This technology is an enabler of small wearable devices as well it provides high signal density. Cicor has been a market leader in this field for many years and is manufacturing flex circuits with a layer-count of 1 to 8. We are working with polyimide foils as thin as 12.5 µm (0.5 mil) and adhesive bond plys starting at a thickness of 12.5 µm (0.5 mil). Our state of the art equipment is enabling us to produce FPCs with high output, reliability and repeatability.

Combining the advantages of both, rigid and flexible PCBs in one circuit board offers several benefits: Replace rigid PCBs, connectors, cables or separate flexible circuit boards by integrating the connection of different parts in one single rigid-flex PCB. Reduce the size of components and enabling 3-dimensional installation of assembled PCBs. Increase reliability, especially in harsh environments including vibration, acceleration or deceleration, as connection is integrated in the circuitry. Improved signal integrity. Reduce logistic effort by combining several components within one single PCB.

Rigid PCBs are available in many different varieties, differentiated by the number of layers, base materials used, construction methods, interconnection schemes as well as areas of use. Cicor is offering rigid PCBs with 1 to 12 layers with a clear focus on miniaturization in x, y and z axis. Cicor is using (ultra-) thin high-end base materials, with CTE values in x and y down to below 8 ppmK-1, to minimize the CTE mismatch. The construction of the boards can either be parallel or sequential. Using state-of-the-art equipment, blind microvias as well as through holes can be drilled either mechanically or with laser. Subsequently, vias can be filled with copper to enable via stacking or staggering and via-in-pad designs. The utilization of these advanced design features is maximizing the design freedom and is one of the key factors for miniaturization.

Since 2016 Cicor has been offering DenciTec® PCBs. Highly sophisticated manufacturing technologies are enabling the production of very high-density circuits. State of the art equipments and new kinds of base-materials are making sure, that no concessions have to be made for Qality and design freedom.