Cicor Management AG
- Home
- Companies
- Cicor Management AG
- Products
- DenciTec - High-Density Circuits
DenciTec - High-Density Circuits
Since 2016 Cicor has been offering DenciTec® PCBs. Highly sophisticated manufacturing technologies are enabling the production of very high-density circuits. State of the art equipments and new kinds of base-materials are making sure, that no concessions have to be made for Qality and design freedom.
Most popular related searches
DenciTec® makes further miniaturization possible:
- Line widths and spacings down to 25 µm (1 mil)
- Copper thicknesses of 20 µm (0.8 mil) +/- 5 µm on all layers
- Laser-via diameters of 30 µm (1.4 mil)
- Annular rings of 30 µm (1.2 mil) for the inner layers and 20 µm (0.8 mil) for the outer layers
- Copper-filled blind vias with the option of via stacking and vias-in-pads
- Even ultra-thin circuits are possible, using a 12.5 µm (0.5 mil) polyimide core material (4-layer flex circuits less than 120 µm (4.7 mil) thick)
- Maximum reliability
More freedom in design – greater functionality for equipment:
- Miniaturization: Significantly greater integration capabilities: More space for additional options such as energy supply (batteries, etc.)
- Higher packing density: More design options, no limitations in the use of design features
- Greater functionality: Smarter products with more functions
- Significantly lower manufacturing costs than with thin-film technology