Electroninks products

Particle-free, polymer-free silver complex ink, Lead-free and halogen-free, Dense microstructure, High electrical and thermal conductivity, Low temperature curing, Adhesion to Epoxy Molding Compound (EMC)

Silver metal complex paste, Lead-free and halogen-free, High electrical and thermal conductivity, Low temperature curing, Fine line printing for mass production, Adhesion to PET, ITO, glass, PVDF, SNW and textiles

Silver metal complex paste designed for adhesion on hydrophobic surfaces, Lead-free and halogen-free, High electrical conductivity and thermal conductivity, Low temperature curing, Strong adhesion to PET, ITO, glass, PVDF, SNW and textiles

EI-1149/EI-1150 ink is formulated for inkjet deposition and for additive/digital manufacturing applications that require high conductivity. This metal-complex particle free ink has stable jetting performance and a long shelf life at room temperature. The low curing profile makes the EI-1100 series suitable for substrates that can withstand 30 minutes of 180o C thermal curing.