RENA Technologies GmbH products

The RENA Direct Stack systems DS Load and DS Unload are designed for loading and unloading of PV inline tools. Key system benefits include simple wafer handling with single side wafer touching, excellent breakage rate, lowest cost of ownership and smallest footprint. The modular concept, with direct stack to lane correlation, enables unique flexibility concerning the lane quantity of the linked inline tool.

 The RENA Direct Carrier systems DC Load and DC Unload are designed for loading and unloading of PV inline tools. Key system benefits include simple wafer handling with single side wafer touching, excellent breakage rate, lowest cost of ownership and small footprint. The modular concept, with direct carrier to lane correlation, enables unique flexibility concerning the lane quantity of the linked inline tool.

  RENA’s ultra compact automation systems C Load UC and C Unload UC are designed for loading and unloading of PV inline tools. Key system benefit consists of the outstandingly short tool length respectively small footprint, allowing installation under most restricted space conditions. Other benefits are single side wafer contact, excellent breakage rate and a very reasonable buffer capacity of at least 6 carriers.

The new RENA inline platform NIAK is designed for easy use and best performance for PV mass production. Intelligent features ensure reliable and stable process control and allow an easy process transfer from one tool to another. Optimised media handling and fluid dynamics reduce the costs of ownership and improve the process performance.

Best in class media consumption. The InTex system removes the surface damage induced by the sawing process and at the same time improves the light trapping into the cell by texturing the surface of the wafer. The InTex series has set the standard for inline saw damage etching and texturing in the PV industry.

The RENA InWaClean removes slurry and sawing residues from separated wafers in a physical-chemical process.