Robotechnik Europe GmbH products

Automatic Microcluster Systems for Lithography Processes in the Semiconductor Industry. The fully-automated microcluster systems of the Maximus Series are designed for single-substrate production processes in the semiconductor industry. The system platform handles wafer sizes from Ø 2” up to Ø 750 mm and substrate sizes from 2” x 2” up to 500 mm x 500 mm. According to the process requirements all Maximus systems can be equipped flexibly with different process units like coater, developer, cleaner, hot, cool and primer plates. The Maximus Series provides all features needed for state of the art production tasks like thin-wafer handling, UV curing or Lift-Off.

Automatic Microcluster Systems for Lithography Processes in the Semiconductor Industry. The fully-automated microcluster systems of the Maximus Series are designed for single-substrate production processes in the semiconductor industry. The system platform handles wafer sizes from Ø 2” up to Ø 750 mm and substrate sizes from 2” x 2” up to 500 mm x 500 mm. According to the process requirements all Maximus systems can be equipped flexibly with different process units like coater, developer, cleaner, hot, cool and primer plates. The Maximus Series provides all features needed for state of the art production tasks like thin-wafer handling, UV curing or Lift-Off.

Fully automatic cluster system for a wide portfolio of applications. Can be equiped with different Modules like Coaters, Cleaners, Developers, Hot-, Cool- and Primer-plates. Can Process Wafers up to 8" and Square Substrates up to 6"x6".

The future technology in the semiconductor industry and production- Stand Alone Spinner system for coating, cleaning and developing within process:

The future technology in the semiconductor industry and production- Coating Module with "Covered Chuck" within process:

The future technology in the semiconductor industry and production- Coating System with "Covered Chuck" within process: Stand - Alone Spin Coating System with "Covered Chuck" technology" for Wafers up to Ø 8" (Ø 200 mm) and substrates up to 6" x 6" (150 mm x 150 mm), for traditional open bowl or covered chuck spinning

The future technology in the semiconductor industry and production- Coating System with a process optimized covered chuck technology:

The future technology in the semi conductor industry and production- bench mounted Hotplate System for typical lithography baking applications:

The future technology in the semi conductor industry and production- stand alone Hotplate System for typical lithography baking applications: