Schmid Group products

First the drill dust is removed, then the smear in the bore holes softened and afterwards completely removed by a permanganate solution.  The result is a micro fine textured resin surface.

With the electroless copper process the PCB normally passes through a total of five process steps to obtain the desired coating thickness of 0.5 µm and more. Depending on the individual process an accelerator level can be integrated if necessary. For an optimum copper deposition in the bore hole maintenance-free fluid jet systems are applied.

DW PreTex can be integrated into the existing production as a modular wet process system without additional requirements – both for wafer and cell manufacturers. For DW PreTex uses common materials used in the PV industry. The operating costs are less than 0.01 Euro per wafer. In addition, the process achieves extremely uniform surfaces with reflection values down to 21 %.

Acid texturing is applied with multi-crystalline wafers. In this process, the impurities and damages incurred in the sawing process are removed. At the same time the surface of the wafer is enlarged. The isotropic surface texture reduces the reflection and thus decisively influences the cell efficiency.

Alkaline texturing is applied with mono-crystalline wafers. It removes the contamination and damage caused by the sawing process. The uniform, pyramid-shaped surface reduces the reflection and thus decisively influences the cell efficiency. SCHMID’s Alkaline Texturing Inline Sytem achieves perfect surface qualities with reflection values of less than 12 %. SCHMID closely cooperates with leading chemical  suppliers  so that ready-to-use chemical solutions are available. A special sprinkling device irrigates the wafers very gently. The continuous exchange of the etching medium results in  shortest process times.

In the area of module production substrate surfaces are cleaned in different qualities depending on the requirements of the downstream processes. With different line configurations particles down to a minimum diameter of 1 µm can be removed from the surface.