Schmid Group products

First the drill dust is removed, then the smear in the bore holes softened and afterwards completely removed by a permanganate solution.  The result is a micro fine textured resin surface.

With the electroless copper process the PCB normally passes through a total of five process steps to obtain the desired coating thickness of 0.5 µm and more. Depending on the individual process an accelerator level can be integrated if necessary. For an optimum copper deposition in the bore hole maintenance-free fluid jet systems are applied.