Scientific Computing International products

The FilmTek™ 6000 PAR-SE is our most advanced film metrology system for film thickness, refractive index and stress measurement for a broad range of film layers at the 1x nm design node and beyond. The FilmTek™ 6000 PAR-SE accommodates 200 or 300 mm wafer metrology. The FilmTek™ 6000 PAR-SE combines spectroscopic ellipsometry and DUV multi-angle polarized reflectometry with a wide spectral range to meet the challenging demands associated with multi-patterning and other leading-edge device fabrication techniques. Manufacturing advanced IC devices at 1x nm design rules requires the use of complex films that must be highly uniform. To maintain tight control over the processes used to build these films requires metrology systems that can monitor extremely thin films that are often within a multi-layer film stack (e.g., high-k and oxide-nitride-oxide films). 

The FilmTekTM CD optical critical dimension system is SCI’s leading-edge solution for fully-automated, high-throughput CD measurement and advanced film analysis for the 1x nm design node and beyond. This system delivers real-time multi-layer stack characterization and CD measurement simultaneously, for both known and completely unknown structures. FilmTekTM CD utilizes patented multimodal measurement technology to meet the challenging demands associated with the most complex semiconductor design features in development and production. This technology enables measurement of extremely small line widths, with high accuracy measurements in the sub-10nm range.