Sempa Systems GmbH products

SEMPA’s GAS’BOT family of specialty gas cabinets have been designed meeting all kinds of different applications and requirements.

CHEM’BOT’s are state of the art liquid chemical delivery systems. CHEM’BOT supplies precursor chemicals to bubblers or vaporizers, direct liquid injections or on-board buffer tank.

Energetic materials like pyrophorics such as Trimethylaluminum (and most other metal organics) used in numerous processes. However, pyrophoric substances do spontaneously ignite on air, hence carry an intrinsically huge risk for fire and potentially dangerous situation while they are used. There have been already too many even fatal incidents in the electronics industry using such precursor materials. CHEM’BOT LCAS is a state of the art Chemical Delivery System including a Leak Containment and Abatement System (LCAS). CHEM’BOT LCAS stands for the utmost in safety and reliability in semiconductor metal organic delivery systems.

Precursor evaporation is required for all gas phase processes, like CVD, ALD or EPI. SEMPA has been developing VAPOR’BOT to address this broad range of applications.

SEMPA LAB is constantly striving for new inventions and solutions for our customers. Our R&D activities and JDP’s (Joint Development Programs) with renowned national and international cooperation partners are also looking into advanced measurement technologies which are required for nowadays high end manufacturing processes. The main focus has been on transfer rates of permeates through barrier materials and certain sensing technology.

ECS1 is an automatic mechanical shut-off system. Dangerous, flammable or toxic gases are applied in numerous industrial processes. ECS1 is a highly efficient method of switching off dangerous gases directly at the source in emergency situations. It is designed to prevent gas explosion and gas poisoning caused by leakage of highly pressurized gases.

Thin Film processing on the scale of single atomic layers is gaining growing interest with the increasing demand of modern structures in microelectronics. Multiple patterning with Atomic Layer Deposition ALD, the deposition of high-k films like Al₂O₃ and Zr/Hf Oxides or 3D structures are key processes for technology milestones beyond 10 nm in logic and memory.