Shenzhen Union Tenda Technology Co., Ltd

Shenzhen Union Tenda Technology Co., Ltd.is a professional high-tech enterprise dedicated to the research and development, production and sales of electronic thermal insulation materials. The company is committed to innovation to create the latest, most effective and cost-effective thermal materials and strive to provide customers the best solution to the heat problems. The company has focused on the thermal interface materials R&D team and more advanced thermal materials production equipment automatic production lines and improve the detection equipment. the main raw materials are selected Denka, Dow Corning For more , please contact rita at szutd.com

Company details

Business Type:
Manufacturer
Industry Type:
Electronics and Computers
Market Focus:
Globally (various continents)
Year Founded:
2011
Employees:
11-100
Turnover:
$100,000,000 US - $1,000,000,000 US

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Thermal Interface Materials are widely used for the heat conduction of IC and electronic products, which is to fill the small gap and rough holes between two materials, to reduce the thermal resistance and improve the thermal conductive performance. To keep the work temperature of the component junction within the safety temperature, the heat from the semiconductor must be transferred to the surroundings. The procedure include the heat transferred from the surface of device to the heatsink and the surroundings. The heat sink should be attached with the device carefully to make the thermal resistance as small as possible. If attach the heat sink with surface of the semiconductor, it requires the two parts should be connected tightly. The surfaces are always rough, which only can be seen under the microscope. When the two surfaces connected, only the high points are touched, the low points form the air gap. And there are over 90%of the contact zone are air gaps ,which means it will be the thermal resistance. The thermal interface materials can fill the air gap and the rough surface, its thermal conductivity is much higher that the air, through the TIMs, the thermal resistance of the junction will be less, and the temperature will be lower.